Iei-integration ICE-DB-9S Manuale Utente Scaricare il pdf (Pagina 7)

ICE Module

Page vii

4.14 MISCELLANEOUS ..............................................................................................82

4.14.1 Signal Description ....................................................................................82

4.14.2 Speaker/FAN Control/RTC Reference.......................................................84

4.14.2.1 Speaker Out........................................................................................84

4.14.2.2 FAN Control.......................................................................................84

4.14.2.3 RTC....................................................................................................85

5 PCB STACK AND POWER DELIVER DESIGN............................................86

5.1 CHAPTER OVERVIEW...........................................................................................87

5.2 MICROSTRIP OR STRIPLINE..................................................................................87

5.3 PCB STACKUP EXAMPLE....................................................................................87

5.3.1 Four-Layer Stack-up...................................................................................88

5.3.2 Six-Layer Stack-up......................................................................................88

5.4 ATX POWER DELIVERY GUIDELINES ..................................................................90

5.4.1 ATX Power Status (S0,S3,S4,S5,G3)...........................................................91

5.4.2 ATX Power Diagram...................................................................................92

6.3.3 ATX Power On Timing................................................................................92

5.5 AT POWER DELIVERY GUIDELINE ......................................................................93

5.5.1 AT Power Diagram.....................................................................................93

5.5.2 AT Power On Timing ..................................................................................94

6 MECHANICAL DESIGN GUIDELINES............................................................95

6.1 CHAPTER OVERVIEW...........................................................................................96

6.2 COM MODULE AND CARRIER BOARD CONNECTOR............................................96

6.2.1 Module Connector ......................................................................................96

6.2.2 Carrier Board Connector ...........................................................................97

6.3 CONNECTOR FOOTPRINT .....................................................................................98

6.4 COM EXPRESS FORM FACTORS..........................................................................99

6.5 HEAT SPREAD....................................................................................................100

6.6 DESIGN NOTES..................................................................................................103

6.6.1 Component Height — Module Back and Carrier Board Top....................103

6.6.2 Air Follow Issue........................................................................................105

6.6.3 Grounding Issue........................................................................................105

6.7 OTHERS KITS SPECIFICATION............................................................................105

6.7.1 Heat Sink...................................................................................................105

A ICE MODULE DESIGN SCHEMATIC CHECK LIST ..................................107

B APPLICATION NOTES...................................................................................... 116

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Iei-integration ICE-DB-9S Manuale Utente Pagina 7