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Type 6 Carrier Board Design Guide
Page IV
Table of Contents
1 INTRODUCTION.......................................................................................................... 1
1.1 INTRODUCTION........................................................................................................... 2
1.2 ICE-QM770 COM EXPRESS MODULE....................................................................... 2
1.2.1 ICE-QM770 Specifications ................................................................................ 3
1.3 ICE-CV-D25501/N26001 COM EXPRESS MODULE.................................................. 4
1.3.1 ICE-CV-D25501/N26001 Specifications ........................................................... 5
1.4 ICE-DB-T6 REFERENCE CARRIER BOARD................................................................. 7
1.4.1 ICE-DB-T6 Specifications ................................................................................. 7
2 PIN ASSIGNMENTS................................................................................................... 10
2.1 CHAPTER OVERVIEW.................................................................................................11
2.2 COM EXPRESS CONNECTOR TYPE ........................................................................... 12
2.3 SIGNAL TABLE TERMINOLOGY................................................................................. 13
2.4 CONNECTOR PINOUT ROW A AND ROW B................................................................. 14
2.5 CONNECTOR PINOUT ROWS C AND D....................................................................... 16
3 SIGNAL DESCRIPTION AND ROUTING GUIDELINE ...................................... 19
3.1 PEG (PCI EXPRESS GRAPHIC) ................................................................................. 20
3.1.1 Signal Description ........................................................................................... 20
3.1.2 PEG Connector................................................................................................ 22
3.1.3 PEG_ENABLE# ............................................................................................... 23
3.1.4 PCI Express Test Points and Probing ............................................................. 23
3.1.5 PCI Express Routing Guideline....................................................................... 24
3.1.5.1 Impedance Consideration.......................................................................... 24
3.1.5.2 AC Coupling Capacitors........................................................................... 25
3.1.5.3 Routing Notices ........................................................................................ 26
3.2 PCI EXPRESS............................................................................................................ 27
3.2.1 Signal Description ........................................................................................... 28
3.2.2 PCI Express x1 Slot ......................................................................................... 29
3.2.3 PCIe Mini Card................................................................................................ 29
3.2.4 PCI Express Clock Buffer................................................................................ 32
- COM Express Type 6 Module 1
- Carrier Board Design Guide 1
- Revision 2
- Copyright 3
- Table of Contents 4
- List of Figures 8
- List of Tables 10
- 1 Introduction 11
- 1.1 Introduction 12
- 2 Pin Assignments 20
- 2.1 Chapter Overview 21
- 2.3 Signal Table Terminology 23
- Page 14 24
- 3 Signal Description and 29
- Routing Guideline 29
- Page 20 30
- 3.1.1 Signal Description 30
- AC Coupling Cap 36
- 3.2 PCI Express 37
- Page 28 38
- 3.2.1 Signal Description 38
- Page 36 46
- 3.4.1 Signal Description 46
- from Semtech 51
- 3.5 DDI 53
- Page 44 54
- 3.6 LVDS 57
- 3.3V(Default) 59
- J_VLVDS1 59
- 3.7.1 Signal Description 61
- 3.8 Reference Circuit 62
- 3.9 LAN (Local Area Network) 63
- Page 58 68
- 3.10.2.1 Keyboard/Mouse 68
- 3.11 VGA 69
- 3.12 Miscellaneous 72
- CLEAR CMOS/Super CAP 74
- 4 PCB Stack and 76
- Power Deliver Design 76
- 4.1 Chapter Overview 77
- 4.2 Microstrip or Stripline 77
- 4.3 PCB Stackup Example 77
- Page 70 80
- Page 72 82
- 4.4.2 ATX Power Diagram 82
- Chapter 83
- 5.1 Chapter Overview 84
- 5.3 Connector Footprint 86
- • 0.8mm +0.075/-0.025mm 87
- • 1.5mm +0.075/-0.025mm 87
- 5.5 Heat Spread 88
- Page 80 90
- 5.6 Design Notes 91
- A Terminology 94
- Page 86 96
- B Application Notes 97
- B.1 Terminology 98
- B.2 Updating BIOS Version 98
- Page 90 100
- Page 92 102
- B.2.2 Using DOS Command 102
- B.3 RTC Overview 104
- C Reference Documents 105
- Page 96 106
- D Reference Carrier 107
- Board Schematic 107
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